Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...
Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...
Fabric might be the last thing on your mind when firefighters rescue someone from a burning building, but without fire-resistant clothing, such rescues might not happen at all. The turnout gear that ...
Cost-effective in-rack systems enable testing of standard 30kW or 50kW NeuCool liquid-cooled racks without multi-million-dollar hardware investments Custom testing configurations available, including ...
Analog fabs are bolstering their electronic design automation (EDA) tool repository to complement design flows in advanced RF devices, and the latest example comes from Tower Semiconductor’s adoption ...
It’s costly and time-consuming to determine the causes of hotspots on circuit boards, and to attempt to arrive at a “well-tempered” board through multiple iterations once a prototype is approved. A ...
Advancements in Building Energy Modeling This year’s Building Simulation conference really dug into how we can make ...
The electronics industry exists in a continuous state of evolution. The world’s biggest companies are either launching new products, or refining and improving existing ones. In keeping with consumer ...
A Web-based tool that gives designers a detailed simulation of how Vishay Siliconix MOSFETs will perform thermally and be affected by adjacent components in a wide range of applications is now ...
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