Norwood, MA (BUSINESS WIRE). Analog Devices Inc. in collaboration with Microsemi Corp. has introduced a high-power evaluation board for half-bridge SiC power modules delivering up to 1,200 V and 50 A ...
Daisuke Koike, Masahiko Hori from Package Solution Technology Development Department, Electronic Devices & Storage Research Development Center, Toshiba Electronic Devices & Storage Corporation ...
Integrated Device Technology, Inc. (IDT®; NASDAQ: IDTI), the Analog and Digital Company™ delivering essential mixed-signal semiconductor solutions, today introduced a new family of low-power, ...
Analog Devices, Inc. has announced the industry’s first high-resolution, industrial quality, indirect Time-of-Flight (iToF) module for 3D depth sensing and vision systems. Enabling cameras and sensors ...
In recent years, various die attach (DA) materials have been developed to cope with the higher power dissipation requirements of semiconductor devices. DA materials based on metals such as solder or ...
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