Key Companies Covered in the 3D Solder Paste Inspection (SPI) System Market Research are MirTec Ltd, Pemtron, CyberOptics Corporation, Koh Young, PARMI Corp, Test Research, Inc (TRI), Vi TECHNOLOGY, ...
"Single Lane - SPC Statistical Process Control - Germany IDS 5.3M Pixel -Machine Customisation is available 3D SPI Specification: Model EKT-8060A Board Handling PCB Size Min: 55*55mm – Max: 400*350mm ...
Test Research of Taiwan has revealed its latest automatic solder paste inspection machine using 3D vision, that can also inspect bumps, flux, mini LEDs and bare boards. Called TR7007Q SII it has a ...
One of the major changes to affect automatic optical inspection (AOI) equipment used during PCB assembly and inspection is the greatly reduced size of the latest components. As stated in an October ...
As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...
Preventing plating and soldering voids is about testing new manufacturing processes and analyzing the results. Plating and soldering voids usually have an identifiable cause, such as the type of ...
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