China's Xiaomi warned last week that smartphone prices were likely to continue to grow in 2026 due to soaring costs of memory chips. The company also admitted to Reuters that if gadget prices go up, ...
Kioxia Corporation today announced that its KIOXIA LC9 Series 245.76 terabyte (TB)(1) enterprise SSD, utilizing a 32-die stack KIOXIA BiCS FLASH(TM) generation 8 QLC 3D flash memory, has received the ...
High Bandwidth Memory (HBM) is the commonly used type of DRAM for data center GPUs like NVIDIA's H200 and AMD's MI325X. High Bandwidth Flash (HBF) is a stack of flash chips with an HBM interface. What ...
The fifth generation of High Bandwidth Memory is currently in use as HBM3E. After SK Hynix delivered samples of the upcoming HBM4 generation with 12 layers of 24 Gbit each back in March, mass ...
IBM's so-called 3D-chip technology is set to be used in next-generation memory processors from Micron Technology, yielding very-high-speed DRAM. Brooke Crothers writes about mobile computer systems, ...
Microsoft announced today a new security feature for the Windows operating system. Named "Hardware-enforced Stack Protection," this feature allows applications to use the local CPU hardware to protect ...
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