Researchers at Fraunhofer Institute for Photonic Microsystems IPMS have developed a method that allows different chip ...

As part of the European APECS pilot line, researchers at Fraunhofer Institute for Photonic Microsystems IPMS have developed a method that allows different chip components to be fused almost seamlessly ...

When merging optical functions, one may need to provide for the continuous propagation of light across a portion of the chip from one structure to another. To minimize or eliminate any trade-offs in ...

Optoelectronic devices, such as infrared sensors and LED displays, are the backbone of modern technologies, from medical imaging to smartphone screens. Traditionally, integrating these devices with ...

Monolithic 3D integrated circuits represent a transformative approach to semiconductor design, where successive layers of devices are fabricated directly on top of one another using low-temperature ...

A new technical paper titled “Monolithically Integrated Optical Through-Silicon Waveguides for 3D Chip-to-Chip Photonic Interconnects” was published by researchers at the Technical University of ...

Last month, in response to my post The Other Side of the Integration Coin, reader TheMeasurementBlues asked if we could consider discrete op-amp or data converter devices as opposed to ICs. My first ...

A flexible monolithic 3D-integrated tactile sensing system, inspired by the tactile perception mechanism of human skin, was developed based on a holey MXene paste. Large-scale device fabrication was ...

We can evaluate the thermal performance of the eGaN monolithic half-bridge IC. The first eGaN monolithic half-bridge IC 5 is the same size as single discrete eGaN FET and has similar package thermal ...

Intel looks more attractive than Monolithic from a valuation standpoint. Going by the price/sales ratio, Intel’s shares ...