Electronic Design

Semiconductor Vendors Turn to Modules

In the next few years, semiconductor suppliers will play a more pivotal role in the future of power. This role definition is driven by a number of factors. The demand for energy continues to ...
Electronic Design

Advanced Package Design Fosters Smaller, More Efficient Semiconductors

Members can download this article in PDF format. Today, advances in semiconductors and ICs are producing ever smaller and denser circuits. With that comes the challenge of efficiently packaging and ...
Semiconductor Engineering

Advanced Packaging Traceability And Root Cause Analysis

One of the defining challenges of advanced packaging lies in maintaining traceability as dies move through multiple ...
Dataquest

L&T Semiconductor acquires power module design assets of Fujitsu

L&T Semiconductor Technologies Ltd (LTSCT), a wholly-owned subsidiary of Larsen & Toubro, has acquired the Power Module Design Assets of Fujitsu General Electronics Ltd (FGEL) of Japan. The strategic ...
Just Auto

Tesla gets grant for multi-chip module with ic dies, sockets, cold plate

Tesla has been granted a patent for a multi-chip module design featuring a Redistribution Layer substrate with IC dies mounted on both surfaces, sockets, and a cold plate. The innovative mounting ...
Semiconductor Engineering

Keeping IC Packages Cool

Placing multiple chips into a package side-by-side can alleviate thermal issues, but as companies dive further into die stacking and denser packaging to boost performance and reduce power, they are ...
EDN

Mastering multi-physics effects in 3D IC design

Stacking dies introduces layers of complexity driven by multi-physics interactions, which must be addressed at the start of design.
Business Wire

ON Semiconductor’s SiC Power Modules to Support Delta’s Solar PV Inverters

PHOENIX--(BUSINESS WIRE)--ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, has introduced a full SiC power module for solar inverter applications, which has been selected by the ...
Hosted on MSN

Big boost for semiconductor mission: India's first multi-chip module rolls out; firm ships 900 power units to US firm AOS

In a significant leap for India’s semiconductor ambitions, the country’s first commercially packaged multi-chip module (MCM) rolled out early Wednesday from Kaynes Semicon’s outsourced semiconductor ...
Digi Times

NeoGene unlocks direct-to-silicon liquid cooling technology by novel IC package approach

NeoGene Tech, a Guangzhou-based Taiwanese thermal management solution provider, has in Q3 2022 supported Xiaomi to successfully launch its flagship 5G smartphone, Xiaomi 12S Ultra, with excellent ...
Digi Times

L&T Semiconductor Technologies acquires Fujitsu General Electronics' power module design assets

India-based IC design firm L&T Semiconductor Technologies (LTSCT) announced on Friday that it has acquired the power module design assets of Japan's Fujitsu General Electronics (FGEL), marking a ...