The shift to advanced packaging in 3D and 2.5D IC design is making the numerical analysis of thermal warpage in electronic devices a crucial part of the design process. A reliable numerical tool ...
Classiq, the global leader for quantum computing software, today announced a joint demonstration with BQP and NVIDIA that showcases an advancement in hybrid quantum-classical simulation for digital ...
The RFPA2D numerical simulation method is only suitable for studying the uniaxial compression failure process, so it has great limitations. To solve these problems, a new numerical simulation method ...
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