Don't be so stuck in the circuits that you forget the importance of IC packages. Here are a couple cards from the Microchip 2005 product selector: While most design engineers are using surface mount ...

Targeting a silicon device for a flip-chip package introduces significant IC and package design complexities throughout the entire product development cycle. This package-die combination must be ...

IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

The electrochemical deposition (ECD) equipment market for IC packaging is heating up as 2.5D, 3D and fan-out technologies begin to ramp. Applied Materials recently rolled out an ECD system for IC ...

How much can one package take? As consumer electronics design features scale down to 45-nm and even 32-nm nodes, IC makers are pushed to the limits to shoehorn more functionality into these packages- ...

Several equipment makers are ramping up new inspection equipment to address the growing defect challenges in IC packaging. At one time, finding defects in packaging was relatively straightforward. But ...

Nuvoton Technology has introduced a high-power violet laser diode designed to support maskless lithography in advanced ...

IC packaging and testing in China generated $29 billion in revenue in 2017, making China the world’s largest consumer of packaging equipment and materials, says SEMI. China’s IC packaging and testing ...

Greater use of ICs in consumer electronics products is pushing the demand for higher-density, lower-cost and higher-performance ICs, giving a greater push to package devices in 3D form. A never-ending ...

The heterogeneous integration packaging solutions unit of 3D Glass Solutions marks a significant capability leap in advanced ...

Samsung is reportedly considering a $4 billion chip packaging and testing project in Vietnam, deepening the country’s role in ...