Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...
BROOKINGS, S.D., May 16, 2024 (GLOBE NEWSWIRE) -- Daktronics (DAKT) (NASDAQ-DAKT) of Brookings, South Dakota, has released its Flip-Chip COB (Chip On Board) LED display technology worldwide. The ...
New bump structures are being developed to enable higher interconnect densities in flip-chip packaging, but they are complex, expensive, and increasingly difficult to manufacture. For products with ...
The latest addition to its Narrow Pixel Pitch (NPP) product family brings tighter pixel spacings with increased durability. When you purchase through links on our site, we may earn an affiliate ...
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