Die-bonding at up to 60,000 flip-chips per hour, is what ITEC is claiming for its ADAT3 XF TwinRevolve. “Instead of the traditional forwards and backwards up-down linear motion, the new die bonder ...
TCFCBGA packages are designed to allow die protrusion over the mold cap. This feature ensures the thinnest band line and best thermal impedance between the flip chip die and the attached heat sink.
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