Previously, we noticed the NEC vaguely defines "bonded (bonding)." Article 100 doesn't, for example, specify how conductive the bonding jumper must be. But throughout the NEC, and especially in Art.

All Code references are based on the 2005 NEC. The grounding and bonding requirements in this column apply to solidly grounded systems that operate at not more than 600V, including 120/240V, 120/208V, ...

MUNICH, Germany — The Fraunhofer Institute for Assembly and Packaging in Microelectronics (Berlin) has launched a research project aiming at the interconnection of light conductors. Current ...

Semiconductor research lab Imec has demonstrated wafer-bonding with 400nm pitch copper conductors across the boundary, proposing the technology for logic-on-logic and memory-on-logic wafer stacking ...