Semiconductor Engineering

Package Assembly Design Kits (PADK) Benefits For Packaging Design Engineers

A new IEEE technical paper titled “Package Assembly Design Kits (PADK’s)- The Future of Advanced Wafer-Level Manufacturing” was written by researchers from Amkor. Find the technical paper here.
Business Wire

Amkor and Cadence to Develop Packaging Assembly Design Kits for Amkor’s SLIM and SWIFT Packaging Technologies

TEMPE, Ariz.--(BUSINESS WIRE)--Amkor Technology, Inc. (NASDAQ: AMKR), a leading outsourced semiconductor packaging and test service provider, today announced the expansion of its collaboration with ...
Engineering News-Record

Only Some Assembly Required: A Kit-of-Parts Approach to Construction

In 2003, Stephen Kieran and James Timberlake wrote Refabricating Architecture, a book that argued the time had come to reevaluate and update basic design and construction methods that have constrained ...
Design-Reuse

Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC

Siemens’ industry-leading Calibre® nmPlatform tool is now certified for the latest Intel 18A production Process Design Kit (PDK). Intel 18A represents a significant technological leap forward, ...
EDN

TSMC, Mentor Create 0.13-M Mixed-Mode, RF Design Kit

Following the trend of EDA tool providers to provide full design and verification solutions, Taiwan Semiconductor Manufacturing Co. (TSMC) and Mentor Graphics Corp. have created a foundry-qualified ...
Arizona Daily Star

Amkor and Cadence to Develop Packaging Assembly Design Kits for Amkor’s SLIM and SWIFT Packaging Technologies

products and its services is available at http://www.cadence.com. Note: The Amkor name and logo are registered trademarks, and SLIM and SWIFT are trademarks of Amkor ...