The semiconductor industry is undergoing a profound shift in packaging technologies to ones that rely on close collaboration among multiple stakeholders to solve intricate, multi-faceted, and ...

Advanced packaging technologies are reshaping how compute platforms are conceived, optimized, and manufactured.

Avnet ASIC, with Bar-Ilan University, announce a collaboration to establish an Advanced Chiplet Innovation Center, scheduled ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a significant shift in system integration strategies. Industry analyses show 3D IC ...

A recent annual forum for the chipmaking equipment and materials sectors was hosted in Tainan, southern Taiwan, bringing together executives from TSMC and its ecosystem partners including Grand ...

TNO at Holst Centre works with a range of thin-film technologies, originally developed for display and electronics applications, that have very interesting potential in other, fast-growing application ...